Renesas Electronics Corp. 70V9169L6BFG
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-PBGA-B100
  • Memory Width
    9
  • Package Code
    LFBGA
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    2
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED OR FLOW THROUGH ARCHITECTURE
  • Memory Organization
    16KX9
  • Number of Functions
    1
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    6.5
  • Number of Words Code
    16K
  • Memory Density (bits)
    147456
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    1.5
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    16384
  • Standby Current-Max (A)
    0.003
  • Standby Voltage-Min (V)
    3
  • Supply Current-Max (mA)
    330
  • Package Equivalence Code
    BGA100,10X10,32
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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