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70T3509MS133BPGI8

Renesas Electronics Corp.

Renesas Electronics Corp. 70T3509MS133BPGI8
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    X-PBGA-B256
  • Memory Width
    36
  • Package Code
    BGA
  • Package Shape
    UNSPECIFIED
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    1MX36
  • Number of Functions
    1
  • Number of Terminals
    256
  • Access Time-Max (ns)
    4.2
  • Number of Words Code
    1M
  • Memory Density (bits)
    37748736
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    2.6
  • Supply Voltage-Min (V)
    2.4
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    1048576
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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70T3509MS133BPGI8
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70T3509MS133BPGI8