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70P254L55BYI

Renesas Electronics Corp.

Renesas Electronics Corp. 70P254L55BYI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B81
  • Memory Width
    16
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    APPLICATION SPECIFIC SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Number of Ports
    2
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    8KX16
  • Number of Functions
    1
  • Number of Terminals
    81
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    55
  • Number of Words Code
    8K
  • Memory Density (bits)
    131072
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    8192
  • Standby Current-Max (A)
    6.0E-6
  • Supply Current-Max (mA)
    25
  • Package Equivalence Code
    BGA81,9X9,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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