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7025L35PFGB8

Renesas Electronics Corp.

Renesas Electronics Corp. 7025L35PFGB8
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width (mm)
    14
  • Length (mm)
    20
  • JESD-30 Code
    R-PQFP-G100
  • Memory Width
    16
  • Package Code
    LQFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Position
    QUAD
  • Memory Organization
    8KX16
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.65
  • Access Time-Max (ns)
    35
  • Number of Words Code
    8K
  • Memory Density (bits)
    131072
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-PRF-38535

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7025L35PFGB8
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7025L35PFGB8