Integrated Device Technology, Inc. 5962-8855204XA | 搜芯易Sourcengine

Integrated Device Technology, Inc. 5962-8855204XA

生命周期状态
Transferred
说明
CDIP 37.20x15.24x1.65 mm 2.54mm Pitch
类别
Semiconductors Memory ICs SRAMs STANDARD SRAM

ECCN
3A001.A.2.C
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
15.24
Length (mm)
37.211
JESD-30 Code
R-GDIP-T28
Memory Width
8
Package Code
DIP
Output Enable
YES
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
STANDARD SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
1
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
32KX8
Number of Functions
1
Number of Terminals
28
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
45
Number of Words Code
32K
Memory Density (bits)
262144
Package Body Material
CERAMIC, GLASS-SEALED
Output Characteristics
3-STATE
Seated Height-Max (mm)
5.08
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
32768
Standby Current-Max (A)
0.0008
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
135
Package Equivalence Code
DIP28,.6
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883