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3DSR32M32VB2410-M

3D PLUS SA

3D PLUS SA 3DSR32M32VB2410-M
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    8.7
  • Length (mm)
    13.7
  • JESD-30 Code
    R-PBGA-B90
  • Memory Width
    32
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Memory Organization
    1MX32
  • Number of Functions
    1
  • Number of Terminals
    90
  • Terminal Pitch (mm)
    0.8
  • Number of Words Code
    1M
  • Memory Density (bits)
    33554432
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.45
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.4
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1048576
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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3DSR32M32VB2410-M
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3DSR32M32VB2410-M