10AS022C3U19I2LP

Intel Corporation

Intel Corporation 10AS022C3U19I2LP
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    20 nm
  • Width (mm)
    19
  • Length (mm)
    19
  • JESD-30 Code
    S-PBGA-B484
  • Organization
    8033 CLBS
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Number of CLBs
    8033
  • Number of Inputs
    192
  • Number of Outputs
    192
  • Terminal Position
    BOTTOM
  • Number of Terminals
    484
  • Terminal Pitch (mm)
    0.8
  • Number of Logic Cells
    220000
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.25
  • Supply Voltage-Max (V)
    0.93
  • Supply Voltage-Min (V)
    0.87
  • Supply Voltage-Nom (V)
    0.9
  • Programmable Logic Type
    FPGA SOC
  • Package Equivalence Code
    BGA484,22X22,32
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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