Integrated Device Technology, Inc. 101514S10C | 搜芯易Sourcengine

Integrated Device Technology, Inc. 101514S10C

生命周期状态
Transferred
REACH
REACH compliant
说明
SB 41.66x10.16x3.56 mm 2.54mm Pitch
类别
Semiconductors Memory ICs SRAMs STANDARD SRAM

ECCN
3A991.b.2.b
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
SEPARATE
JESD-30 Code
R-XDIP-T32
Memory Width
4
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
STANDARD SRAM
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
DUAL
Memory Organization
256KX4
Number of Terminals
32
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
10
Number of Words Code
256K
Memory Density (bits)
1048576
Package Body Material
CERAMIC
Output Characteristics
OPEN-EMITTER
Number of Words (words)
262144
Supply Current-Max (mA)
260
Package Equivalence Code
DIP32,.4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0