GENERAL PURPOSE INDUCTOR

General Purpose Inductor, 2.2uH, 3%, 1 Element, Ceramic-Core, SMD

General Purpose Inductor, 2.2uH, 5%, 1 Element, Ceramic-Core, SMD, 0907

General Purpose Inductor, 0.027uH, 2%, 1 Element, Ceramic-Core, SMD, 0907

General Purpose Inductor, 2200uH, 2%, 1 Element, Ceramic-Core, SMD

General Purpose Inductor, 0.39uH, 3%, 1 Element, Ceramic-Core, SMD

General Purpose Inductor, 0.39uH, 5%, 1 Element, Ceramic-Core, SMD

General Purpose Inductor, 0.047uH, 2%, 1 Element, Ceramic-Core, SMD, 0907

General Purpose Inductor, 0.56uH, 10%, 1 Element, Ceramic-Core, SMD

General Purpose Inductor, 1.2uH, 5%, 1 Element, Ferrite-Core, SMD, 0805

General Purpose Inductor, 2.7uH, 5%, 1 Element, Ferrite-Core, SMD, 0805

General Purpose Inductor, 0.015uH, 5%, 1 Element, Ceramic-Core, SMD, 0805

General Purpose Inductor, 0.018uH, 2%, 1 Element, Ceramic-Core, SMD, 0805

General Purpose Inductor, 0.039uH, 2%, 1 Element, Ceramic-Core, SMD, 0805

General Purpose Inductor, 0.047uH, 2%, 1 Element, Ceramic-Core, SMD, 0805

General Purpose Inductor, 3.3uH, 5%, 1 Element, Ceramic-Core, SMD, 0805

Chip inductor, type Fastron 0805AS./0805AQ./0805F. Size 0805, molded in epoxy resin, smooth finish. Solderable up to max. +260 °C/10 s. With ceramic carrier material, type 0805AS.

General Purpose Inductor, 5.6uH, 5%, 1 Element, Ceramic-Core, SMD, 0805

Inductor RF Chip Molded Wirewound 5.6uH 10% 7.9MHz 15Q-Factor Ceramic 0.09A 9.5Ohm DCR 0805 Automotive AEC-Q200 T/R

General Purpose Inductor, 0.0087uH, 5%, 1 Element, Ceramic-Core, SMD, 0805

General Purpose Inductor, 0.01uH, 5%, 1 Element, Ceramic-Core, SMD, 0805

Inductor RF Chip Molded Wirewound 0.3uH 5% 100MHz 40Q-Factor Ceramic 0.26A 1.8Ohm DCR 0805 Automotive AEC-Q200 T/R

General Purpose Inductor, 1uH, 5%, 1 Element, Ferrite-Core, SMD, 0805

General Purpose Inductor, 10uH, 5%, 1 Element, Ferrite-Core, SMD, 0805

General Purpose Inductor, 0.82uH, 2%, 1 Element, Ceramic-Core, SMD, 0805

General Purpose Inductor, 0.043uH, 20%, 1 Element, Ceramic-Core, SMD, 0907