Microsemi Corporation ZL30312GKG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    17 mm
  • Length
    17 mm
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    1 mm
  • Telecom IC Type
    SUPPORT CIRCUIT
  • Seated Height-Max
    1.97 mm
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    256
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA256,16X16,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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ZL30312GKG