ADVANCED INTERCONNECTIONS CORP XTSG329-713GGYC | 搜芯易Sourcengine

ADVANCED INTERCONNECTIONS CORP XTSG329-713GGYC

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
IC Socket, BGA329, 329 Contact(s), 1.27mm Term Pitch, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
RND PIN-SKT
J-STD-609 Code
e4
Mounting Style
STRAIGHT
Contact Material
BERYLLIUM COPPER ALLOY
Housing Material
POLYPHENYLENE SULFIDE
Termination Type
SOLDER
Additional Feature
UL-94V-0, BGA SOCKET
Device Socket Type
IC SOCKET
Number of Contacts
329
Device Type Used On
BGA329
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
1.27
Contact Configuration
RECTANGLE
Contact Finish - Mating
GOLD OVER NICKEL
Mating Contact Pitch (inch)
0.1
Contact Finish - Termination
GOLD OVER NICKEL