Xilinx,Inc. XQ17V16CCG44M | 搜芯易Sourcengine

Xilinx,Inc. XQ17V16CCG44M

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Configuration Memory, 2MX8, 20ns, Parallel/serial, CMOS, CQCC44
类别
Semiconductors Memory ICs EEPROMs CONFIGURATION MEMORY

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Technology
CMOS
Width (mm)
16.51
Length (mm)
16.51
JESD-30 Code
S-CQCC-J44
Memory Width
8
Package Code
QCCJ
Package Shape
SQUARE
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
Memory IC Type
CONFIGURATION MEMORY
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL/SERIAL
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
QUAD
Memory Organization
2MX8
Number of Functions
1
Number of Terminals
44
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
20
Number of Words Code
2M
Memory Density (bits)
16777216
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Seated Height-Max (mm)
4.826
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
2097152
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED