Freescale Semiconductor, Inc. XPC862PZP80B | 搜芯易Sourcengine

Freescale Semiconductor, Inc. XPC862PZP80B

生命周期状态
Transferred
说明
SoC, CMOS, PBGA357
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
5A991
ECCN Governance
EAR
HTS Code
8542.31.00.01
SB Code
8542.31.00.00

Technology
CMOS
Width (mm)
25
Length (mm)
25
JESD-30 Code
S-PBGA-B357
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Terminal Position
BOTTOM
Number of Terminals
357
Terminal Pitch (mm)
1.27
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.05
Supply Voltage-Max (V)
3.465
Supply Voltage-Min (V)
3.135
Supply Voltage-Nom (V)
3.3
Package Equivalence Code
BGA357,19X19,50
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
220
Time@Peak Reflow Temperature-Max (s)
30