XPC860ENZP40
Motorola,Inc.
- 生命周期状态Discontinued
- 说明SoC, CMOS, PBGA357
- 类别
- HTS Code8542.31.00.30
- SB Code8542.31.00.30
- TechnologyCMOS
- Width (mm)25
- Length (mm)25
- JESD-30 CodeS-PBGA-B357
- Package CodeBGA
- Package ShapeSQUARE
- Package StyleGRID ARRAY Meter
- Surface MountYES
- Terminal FormBALL
- J-STD-609 Codee0
- Terminal FinishTin/Lead (Sn/Pb)
- DLA QualificationNot Qualified
- Temperature GradeCOMMERCIAL
- Terminal PositionBOTTOM
- Number of Terminals357
- Terminal Pitch (mm)1.27
- Package Body MaterialPLASTIC/EPOXY
- Seated Height-Max (mm)2.05
- Supply Voltage-Max (V)3.6
- Supply Voltage-Min (V)3
- Supply Voltage-Nom (V)3.3
- Package Equivalence CodeBGA357,19X19,50
- uPs/uCs/Peripheral ICs TypeSoC
- Operating Temperature-Max (Cel)70
- Operating Temperature-Min (Cel)0
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XPC860ENZP40