Motorola,Inc. XPC860ENCZP50D3 | 搜芯易Sourcengine

Motorola,Inc. XPC860ENCZP50D3

生命周期状态
Active
说明
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 50MHz 357-Pin BGA
类别
Semiconductors UPs/uCs/Peripheral ICs Microprocessors

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
25
Length (mm)
25
JESD-30 Code
S-PBGA-B357
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Terminal Position
BOTTOM
Number of Terminals
357
Terminal Pitch (mm)
1.27
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.05
Supply Voltage-Max (V)
3.465
Supply Voltage-Min (V)
3.135
Supply Voltage-Nom (V)
3.3
uPs/uCs/Peripheral ICs Type
SoC