Xilinx,Inc. XCZU7CG-L1FBVB900I | 搜芯易Sourcengine

Xilinx,Inc. XCZU7CG-L1FBVB900I

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA900
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
5A002.A.4
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
JESD-30 Code
R-PBGA-B900
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Number of Terminals
900
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (V)
0.742
Supply Voltage-Min (V)
0.698
Supply Voltage-Nom (V)
0.72
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
245
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30