Advanced Micro Devices, Inc. (AMD) XCZU4EG-3FBVB900E | 搜芯易Sourcengine

Advanced Micro Devices, Inc. (AMD) XCZU4EG-3FBVB900E

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA900
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
JESD-30 Code
R-PBGA-B900
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Temperature Grade
OTHER
Terminal Position
BOTTOM
Number of Terminals
900
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (V)
0.927
Supply Voltage-Min (V)
0.873
Supply Voltage-Nom (V)
0.9
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
245
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30