Xilinx,Inc. XCZU19EG-3FFVC1760E | 搜芯易Sourcengine

Xilinx,Inc. XCZU19EG-3FFVC1760E

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA1760
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
5A002.A.4
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
JESD-30 Code
R-PBGA-B1760
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Temperature Grade
OTHER
Terminal Position
BOTTOM
Number of Terminals
1760
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (V)
0.927
Supply Voltage-Min (V)
0.873
Supply Voltage-Nom (V)
0.9
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
245
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30