产品制造商
提交询价BOM 工具

XCVP2802-1MSEVSVA5601

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCVP2802-1MSEVSVA5601
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    70
  • Length (mm)
    70
  • JESD-30 Code
    S-PBGA-B5601
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    5601
  • Terminal Pitch (mm)
    0.92
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.55
  • Supply Voltage-Max (V)
    0.825
  • Supply Voltage-Min (V)
    0.775
  • Supply Voltage-Nom (V)
    0.8
  • Package Equivalence Code
    BGA5601,75X75,36
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    0

XCVP2802-1MSEVSVA5601有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
XCVP2802-1MSEVSVA5601
提交询价
XCVP2802-1MSEVSVA5601