Xilinx,Inc. XCVP2502-1LSEVSVB3340 | 搜芯易Sourcengine

Xilinx,Inc. XCVP2502-1LSEVSVB3340

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA3340
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
55
Length (mm)
55
JESD-30 Code
S-PBGA-B3340
Package Code
HBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Position
BOTTOM
Number of Terminals
3340
Terminal Pitch (mm)
0.92
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
4.4
Supply Voltage-Max (V)
0.724
Supply Voltage-Min (V)
0.676
Supply Voltage-Nom (V)
0.7
Package Equivalence Code
BGA3340,58X58,36
uPs/uCs/Peripheral ICs Type
SoC
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
0