Xilinx,Inc. XCVP1002-1LSENFVI1369 | 搜芯易Sourcengine

Xilinx,Inc. XCVP1002-1LSENFVI1369

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA1369
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
35
Length (mm)
35
JESD-30 Code
S-PBGA-B1369
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Position
BOTTOM
Number of Terminals
1369
Terminal Pitch (mm)
0.92
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.83
Supply Voltage-Max (V)
0.724
Supply Voltage-Min (V)
0.676
Supply Voltage-Nom (V)
0.7
Package Equivalence Code
BGA1369,37X37,36
uPs/uCs/Peripheral ICs Type
SoC
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
0