Xilinx,Inc. XCVM1302-3MSEVSVD1760 | 搜芯易Sourcengine

Xilinx,Inc. XCVM1302-3MSEVSVD1760

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA1760
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
40
Length (mm)
40
JESD-30 Code
S-PBGA-B1760
Package Code
HBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Position
BOTTOM
Number of Terminals
1760
Terminal Pitch (mm)
0.92
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
4
Supply Voltage-Max (V)
0.825
Supply Voltage-Min (V)
0.775
Supply Voltage-Nom (V)
0.8
Package Equivalence Code
BGA1760,42X42,36
uPs/uCs/Peripheral ICs Type
SoC