Xilinx,Inc. XCVM1302-3MSEVFVA1760 | 搜芯易Sourcengine

Xilinx,Inc. XCVM1302-3MSEVFVA1760

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA1760
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
JESD-30 Code
R-PBGA-B1760
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Position
BOTTOM
Number of Terminals
1760
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (V)
0.825
Supply Voltage-Min (V)
0.775
Supply Voltage-Nom (V)
0.8
uPs/uCs/Peripheral ICs Type
SoC