Xilinx,Inc. XCVM1102-3HSISFVA784 | 搜芯易Sourcengine

Xilinx,Inc. XCVM1102-3HSISFVA784

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SoC, CMOS, PBGA784
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

HTS Code
8542.31.00.01
SB Code
8542.31.00.70

Technology
CMOS
Width (mm)
23
Length (mm)
23
JESD-30 Code
S-PBGA-B784
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Terminal Position
BOTTOM
Number of Terminals
784
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.66
Supply Voltage-Max (V)
0.906
Supply Voltage-Min (V)
0.854
Supply Voltage-Nom (V)
0.88
Package Equivalence Code
BGA784,28X28,32
uPs/uCs/Peripheral ICs Type
SoC
Operating Temperature-Max (Cel)
110
Operating Temperature-Min (Cel)
-40