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XCKU115-1FLVA2104I

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCKU115-1FLVA2104I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    16 nm
  • Width (mm)
    47.5
  • Length (mm)
    47.5
  • JESD-30 Code
    S-PBGA-B2104
  • Organization
    5520 CLBS
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    5520
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Number of Inputs
    832
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    832
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    2104
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    1451100
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.11
  • Supply Voltage-Max (V)
    0.979
  • Supply Voltage-Min (V)
    0.922
  • Supply Voltage-Nom (V)
    .95
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA2104,46X46,40
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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