Xilinx,Inc. XC7Z045-2FFG676I | 搜芯易Sourcengine

Xilinx,Inc. XC7Z045-2FFG676I

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
AMD XILINX - XC7Z045-2FFG676I - PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
类别
Semiconductors Programmable Logic ICs Field Programmable Gate Arrays FPGA SOC

ECCN
3A991.D
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
28 nm
Width (mm)
27
Length (mm)
27
JESD-30 Code
S-PBGA-B676
Organization
27325 CLBS
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Number of CLBs
27325
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Inputs
378
Number of Outputs
378
Terminal Position
BOTTOM
Number of Terminals
676
Terminal Pitch (mm)
1
Number of Logic Cells
350000
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.37
Supply Voltage-Max (V)
1.03
Supply Voltage-Min (V)
0.97
Supply Voltage-Nom (V)
1
Programmable Logic Type
FPGA SOC
Package Equivalence Code
BGA676,26X26,40
Moisture Sensitivity Level
4
Peak Reflow Temperature (Cel)
250
Operating Temperature-Max (Cel)
100
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30