Advanced Micro Devices, Inc. (AMD) XC7Z020-3CLG400I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B400
  • Organization
    6650 CLBS, 1300000 GATES
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    6650
  • Terminal Finish
    TIN SILVER COPPER
  • Number of Inputs
    255
  • Number of Outputs
    255
  • Terminal Position
    BOTTOM
  • Number of Terminals
    400
  • Terminal Pitch (mm)
    0.8
  • Number of Logic Cells
    85000
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Max (V)
    1.05
  • Supply Voltage-Min (V)
    0.95
  • Supply Voltage-Nom (V)
    1
  • Programmable Logic Type
    FPGA SOC
  • Package Equivalence Code
    BGA400,20X20,32
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    1300000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.94

XC7Z020-3CLG400I有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
XC7Z020-3CLG400I
提交询价
XC7Z020-3CLG400I