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XC2C32-4CPG56I

Xilinx,Inc.

Xilinx,Inc. XC2C32-4CPG56I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.55
  • Technology
    CMOS
  • Width (mm)
    6
  • Length (mm)
    6
  • JESD-30 Code
    S-PBGA-B56
  • Organization
    1 DEDICATED INPUTS, 33 I/O
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Output Function
    MACROCELL
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    FAST ZERO POWER DESIGN TECHNOLOGY
  • Number of I/O Lines
    33
  • Number of Terminals
    56
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    4.5
  • Seated Height-Max (mm)
    1.35
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Programmable Logic Type
    FLASH PLD
  • Package Equivalence Code
    BGA56,10X10,20
  • Moisture Sensitivity Level
    3
  • Number of Dedicated Inputs
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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