Advanced Micro Devices, Inc. (AMD) XC2C256-6CP132C
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.55
  • JTAG BST
    YES
  • Technology
    CMOS
  • Width (mm)
    8
  • Length (mm)
    8
  • Architecture
    PLA-TYPE
  • JESD-30 Code
    S-PBGA-B132
  • Organization
    0 DEDICATED INPUTS, 106 I/O
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Output Function
    MACROCELL
  • Terminal Finish
    TIN LEAD
  • Number of Inputs
    106
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    106
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    REAL DIGITAL DESIGN TECHNOLOGY
  • Number of I/O Lines
    106
  • Number of Terminals
    132
  • Terminal Pitch (mm)
    0.5
  • Number of Macro Cells
    256
  • Package Body Material
    PLASTIC/EPOXY
  • In-System Programmable
    YES
  • Propagation Delay (ns)
    6
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Programmable Logic Type
    FLASH PLD
  • Package Equivalence Code
    BGA132,14X14,20
  • Clock Frequency-Max (MHz)
    139
  • Moisture Sensitivity Level
    3
  • Number of Dedicated Inputs
    0
  • Peak Reflow Temperature (Cel)
    240
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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