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XC18V256PC20I

Xilinx,Inc.

Xilinx,Inc. XC18V256PC20I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    8.9662 mm
  • Length
    8.9662 mm
  • Endurance
    10000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    S-PQCC-J20
  • Memory Width
    8
  • Organization
    32KX8
  • Package Code
    QCCJ
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Memory Density
    262144 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    15 ns
  • Number of Words
    32768 words
  • Parallel/Serial
    PARALLEL/SERIAL
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • Seated Height-Max
    4.572 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Supply Current-Max
    25 mA
  • Number of Functions
    1
  • Number of Terminals
    20
  • Standby Current-Max
    0.01 Amp
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    10
  • Package Equivalence Code
    LDCC20,.4SQ
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    33 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Time@Peak Reflow Temperature-Max (s)
    30

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XC18V256PC20I