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XC17V02PC44C

Xilinx,Inc.

Xilinx,Inc. XC17V02PC44C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    16.5862
  • Length (mm)
    16.5862
  • JESD-30 Code
    S-PQCC-J44
  • Memory Width
    1
  • Package Code
    QCCJ
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • J-STD-609 Code
    e0
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Memory Organization
    2MX1
  • Number of Functions
    1
  • Number of Terminals
    44
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    2M
  • Memory Density (bits)
    2097152
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    4.57
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    0.001
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    LDCC44,.7SQ
  • Clock Frequency-Max (MHz)
    15
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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XC17V02PC44C