Xilinx,Inc. XC17S50XLSOG20I | 搜芯易Sourcengine

Xilinx,Inc. XC17S50XLSOG20I

生命周期状态
Discontinued
RoHS
符合RoHS标准
REACH
REACH compliant
说明
Configuration Memory, 559232X1, Serial, CMOS, PDSO20
类别
Semiconductors Memory ICs EEPROMs CONFIGURATION MEMORY

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
Width (mm)
7.5
Length (mm)
12.8
JESD-30 Code
R-PDSO-G20
Memory Width
1
Package Code
SOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e3
Memory IC Type
CONFIGURATION MEMORY
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Terminal Finish
Matte Tin (Sn)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Memory Organization
559232X1
Number of Functions
1
Number of Terminals
20
Terminal Pitch (mm)
1.27
Number of Words Code
559232
Memory Density (bits)
559232
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.65
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
559232
Programming Voltage (V)
3.3
Standby Current-Max (A)
5.0E-5
Supply Current-Max (mA)
5
Package Equivalence Code
SOP20,.4
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30