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XC17S30SOG8I

Xilinx,Inc.

Xilinx,Inc. XC17S30SOG8I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    1
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    247968X1
  • Number of Functions
    1
  • Number of Terminals
    8
  • Number of Words Code
    247968
  • Memory Density (bits)
    247968
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    247968
  • Programming Voltage (V)
    5
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    SOP8,.25
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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