Xilinx,Inc. XC1718DPC20I | 搜芯易Sourcengine

Xilinx,Inc. XC1718DPC20I

生命周期状态
Discontinued
说明
Configuration Memory, 18144X1, CMOS, PQCC20
类别
Semiconductors Memory ICs EPROMs CONFIGURATION MEMORY

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

I/O Type
COMMON
Technology
CMOS
Width (mm)
8.9662
Length (mm)
8.9662
JESD-30 Code
S-PQCC-J20
Memory Width
1
Package Code
QCCJ
Package Shape
SQUARE
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
J-STD-609 Code
e0
Memory IC Type
CONFIGURATION MEMORY
Operating Mode
SYNCHRONOUS
Parallel/Serial
SERIAL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Memory Organization
18144X1
Number of Functions
1
Number of Terminals
20
Terminal Pitch (mm)
1.27
Number of Words Code
18144
Memory Density (bits)
18144
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
4.572
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
18144
Standby Current-Max (A)
0.0015
Supply Current-Max (mA)
10
Package Equivalence Code
LDCC20,.4SQ
Clock Frequency-Max (MHz)
5
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30