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X76F102M8IG-2

IC MICROSYSTEMS SDN BHD

IC MICROSYSTEMS SDN BHD X76F102M8IG-2
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    3 mm
  • Length
    3 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PDSO-G8
  • Memory Width
    8
  • Organization
    128X8
  • Package Code
    TSSOP
  • Package Shape
    SQUARE
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    1024 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.65 mm
  • Number of Words
    128 words
  • Parallel/Serial
    SERIAL
  • Seated Height-Max
    1.1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Programming Voltage
    2.7 V
  • Number of Words Code
    128
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    2 V
  • Supply Voltage-Nom (Vsup)
    3 V
  • Clock Frequency-Max (fCLK)
    1 MHz
  • Write Cycle Time-Max (tWC)
    10 ms
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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X76F102M8IG-2
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X76F102M8IG-2