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X76F100P-3.0

IC MICROSYSTEMS SDN BHD

IC MICROSYSTEMS SDN BHD X76F100P-3.0
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Endurance
    100000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    8
  • Organization
    128X8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    1024 bit
  • Memory IC Type
    FLASH
  • Terminal Pitch
    2.54 mm
  • Number of Words
    128 words
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    TIN LEAD
  • Write Protection
    SOFTWARE
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    3 mA
  • Number of Terminals
    8
  • Standby Current-Max
    1.0E-6 Amp
  • Number of Words Code
    128
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    100
  • Package Equivalence Code
    DIP8,.3
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Clock Frequency-Max (fCLK)
    1 MHz
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    240

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X76F100P-3.0
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X76F100P-3.0