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X25C02MM

IC MICROSYSTEMS SDN BHD

IC MICROSYSTEMS SDN BHD X25C02MM
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    3
  • Length (mm)
    3
  • JESD-30 Code
    S-PDSO-G8
  • Memory Width
    8
  • Package Code
    TSSOP
  • Package Shape
    SQUARE
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Terminal Finish
    TIN LEAD
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    256X8
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.65
  • Number of Words Code
    256
  • Memory Density (bits)
    2048
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.07
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Data Retention Time-Min
    100
  • Number of Words (words)
    256
  • Standby Current-Max (A)
    0.00015
  • Supply Current-Max (mA)
    2
  • Package Equivalence Code
    TSSOP8,.19
  • Clock Frequency-Max (MHz)
    1
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    240
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Write Cycle Time-Max (tWC) (ms)
    10

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X25C02MM
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X25C02MM