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X25650Z

XICOR INC

XICOR INC X25650Z
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    2.118 mm
  • Length
    4.048 mm
  • Endurance
    100000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B8
  • Memory Width
    8
  • Organization
    8KX8
  • Package Code
    VBGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    65536 bit
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Number of Words
    8192 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Terminal Finish
    TIN LEAD
  • Write Protection
    HARDWARE/SOFTWARE
  • Seated Height-Max
    0.675 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    5 mA
  • Number of Functions
    1
  • Number of Terminals
    8
  • Standby Current-Max
    1.0E-6 Amp
  • Number of Words Code
    8K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    100
  • Package Equivalence Code
    BGA8,2X4,48/40
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V
  • Clock Frequency-Max (fCLK)
    5 MHz
  • Write Cycle Time-Max (tWC)
    10 ms

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