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WF1M32B-150HM3

Microsemi Corporation

Microsemi Corporation WF1M32B-150HM3
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Width (mm)
    30.1
  • Length (mm)
    30.1
  • JESD-30 Code
    S-CPGA-P66
  • Memory Width
    32
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    ALSO HAVING 8-BIT MEMORY WIDTH
  • Memory Organization
    1MX32
  • Number of Functions
    1
  • Number of Terminals
    66
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    150
  • Number of Words Code
    1M
  • Memory Density (bits)
    33554432
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Alternate Memory Width
    16
  • Seated Height-Max (mm)
    7.11
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    1048576
  • Programming Voltage (V)
    3.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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WF1M32B-150HM3
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WF1M32B-150HM3