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WEDPY256K72V-166BM

MERCURY SYSTEMS INC

MERCURY SYSTEMS INC WEDPY256K72V-166BM
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B159
  • Memory Width
    72
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE, ALSO CONFIGURABLE AS 1M X 18, OR 512K X 36
  • Memory Organization
    256KX72
  • Number of Functions
    1
  • Number of Terminals
    159
  • Access Time-Max (ns)
    3.5
  • Number of Words Code
    256K
  • Memory Density (bits)
    18874368
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    262144
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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