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WED7G352IDE33ADC25

Microsemi Corporation

Microsemi Corporation WED7G352IDE33ADC25
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-XDMA-N144
  • Memory Width
    16
  • Organization
    22MX16
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    369098752 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    SYNCHRONOUS
  • Number of Words
    23068672 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    144
  • Programming Voltage
    3.3 V
  • Number of Words Code
    22M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.465 V
  • Supply Voltage-Min (Vsup)
    3.135 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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