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WED7G127ATA33XDI25

Microsemi Corporation

WED7G127ATA33XDI25 产品规格书
Microsemi Corporation WED7G127ATA33XDI25
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-XDMA-N144
  • Memory Width
    16
  • Organization
    64MX16
  • Package Code
    DIMM
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    1073741824 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Number of Words
    67108864 words
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Additional Feature
    CAN ALSO OPERATE WITH A 5V SUPPLY
  • Number of Functions
    1
  • Number of Terminals
    144
  • Programming Voltage
    3.3 V
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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