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WED3DG644V75D1I-S

Microsemi Corporation

Microsemi Corporation WED3DG644V75D1I-S
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.24
  • SB Code
    8542.32.00.15
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-XZMA-N144
  • Memory Width
    64
  • Organization
    4MX64
  • Package Code
    DIMM
  • Self Refresh
    YES
  • JESD-609 Code
    e4
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    268435456 bit
  • Memory IC Type
    SYNCHRONOUS DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Number of Words
    4194304 words
  • Terminal Finish
    GOLD
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    ZIG-ZAG
  • Additional Feature
    AUTO/SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    144
  • Number of Words Code
    4M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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