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WED3DG6435V75D1-M

Microsemi Corporation

Microsemi Corporation WED3DG6435V75D1-M
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDMA-N144
  • Memory Width
    64
  • Package Code
    DIMM
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory IC Type
    SYNCHRONOUS DRAM MODULE
  • Refresh Cycles
    8192
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    32MX64
  • Number of Terminals
    144
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    5.4
  • Number of Words Code
    32M
  • Memory Density (bits)
    2147483648
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    33554432
  • Standby Current-Max (A)
    0.016
  • Supply Current-Max (mA)
    2280
  • Package Equivalence Code
    DIMM144,32
  • Clock Frequency-Max (MHz)
    133
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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