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WED3C7410E16MC450BHI

Microsemi Corporation

Microsemi Corporation WED3C7410E16MC450BHI
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Technology
    CMOS
  • Width (mm)
    21.21
  • Length (mm)
    25.25
  • Speed (MHz)
    450
  • JESD-30 Code
    R-PBGA-B255
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    LG-MAX;WD-MAX;SEATED HT-CALCULATED
  • Number of Terminals
    255
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.11
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • External Data Bus Width
    64
  • Clock Frequency-Max (MHz)
    133
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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