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WED3C7410E16M400BHLI

Microsemi Corporation

Microsemi Corporation WED3C7410E16M400BHLI
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Format
    FLOATING POINT
  • Technology
    CMOS
  • Speed (MHz)
    100
  • JESD-30 Code
    R-CBGA-B255
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    TIN LEAD
  • Integrated Cache
    YES
  • Address Bus Width
    64
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    255
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • External Data Bus Width
    32
  • Clock Frequency-Max (MHz)
    400
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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