Winbond Electronics Corporation W97AH6NBVA2I | 搜芯易Sourcengine

Winbond Electronics Corporation W97AH6NBVA2I

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
LPDDR2 DRAM, 64MX16, CMOS, PBGA134
类别
Semiconductors Memory ICs DRAMs LPDDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.32
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
Width (mm)
10
Access Mode
MULTI BANK PAGE BURST
Length (mm)
11.5
JESD-30 Code
R-PBGA-B134
Memory Width
16
Package Code
VFBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
LPDDR2 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Memory Organization
64MX16
Number of Functions
1
Number of Terminals
134
Terminal Pitch (mm)
0.65
Number of Words Code
64M
Memory Density (bits)
1073741824
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1
Supply Voltage-Max (V)
1.3
Supply Voltage-Min (V)
1.14
Supply Voltage-Nom (V)
1.2
Number of Words (words)
67108864
Sequential Burst Length
4,8,16
Supply Current-Max (mA)
32
Interleaved Burst Length
4,8,16
Package Equivalence Code
BGA134,10X17,25
Clock Frequency-Max (MHz)
533
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED