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W979H6KBQX1E

Winbond Electronics Corporation

Winbond Electronics Corporation W979H6KBQX1E
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • Technology
    CMOS
  • Width (mm)
    12
  • Access Mode
    FOUR BANK PAGE BURST
  • Length (mm)
    12
  • JESD-30 Code
    S-PBGA-B168
  • Memory Width
    16
  • Package Code
    VFBGA
  • Self Refresh
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    LPDDR2 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
  • Memory Organization
    32MX16
  • Number of Functions
    1
  • Number of Terminals
    168
  • Terminal Pitch (mm)
    0.5
  • Number of Words Code
    32M
  • Memory Density (bits)
    536870912
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.8
  • Supply Voltage-Max (V)
    1.3
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • Number of Words (words)
    33554432
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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