Winbond Electronics Corporation W9464G2IB-5 | 搜芯易Sourcengine

Winbond Electronics Corporation W9464G2IB-5

生命周期状态
Active
RoHS
符合RoHS标准
REACH
REACH compliant
说明
DDR1 DRAM, 512KX32, 0.7ns, CMOS, PBGA144
类别
Semiconductors Memory ICs DRAMs DDR1 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.02
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
Width (mm)
12
Access Mode
FOUR BANK PAGE BURST
Length (mm)
12
JESD-30 Code
S-PBGA-B144
Memory Width
32
Package Code
LFBGA
Self Refresh
YES
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR1 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
2048
Number of Ports
1
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
512KX32
Number of Functions
1
Number of Terminals
144
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
0.7
Number of Words Code
512K
Memory Density (bits)
16777216
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.4
Supply Voltage-Max (V)
2.7
Supply Voltage-Min (V)
2.3
Supply Voltage-Nom (V)
2.5
Number of Words (words)
524288
Sequential Burst Length
2,4,8
Standby Current-Max (A)
0.03
Supply Current-Max (mA)
240
Interleaved Burst Length
2,4,8
Clock Frequency-Max (MHz)
200
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED