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W764M32V-120SBI

Microsemi Corporation

Microsemi Corporation W764M32V-120SBI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    YES
  • Width (mm)
    14.1
  • Length (mm)
    17.1
  • Data Polling
    YES
  • JESD-30 Code
    R-PBGA-B107
  • Memory Width
    32
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    LG-MAX; WD-MAX; SEATED HGT CALCULATED
  • Memory Organization
    64MX32
  • Number of Functions
    1
  • Number of Terminals
    107
  • Sector Size (words)
    128K
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    120
  • Number of Words Code
    64M
  • Memory Density (bits)
    2147483648
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Common Flash Interface
    YES
  • Number of Sectors/Size
    512
  • Seated Height-Max (mm)
    3.11
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    67108864
  • Programming Voltage (V)
    3
  • Standby Current-Max (A)
    2.0E-5
  • Supply Current-Max (mA)
    320
  • Package Equivalence Code
    BGA107,9X12,40
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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W764M32V-120SBI
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W764M32V-120SBI